Wafer Process Systems Inc.

Systems Integration

 

Welcome to WPS Systems Integration

a Leading Supplier of Wet Chemical Process Equipment to the Semiconductor, MEMS, Photonics, Solar Cell, RFID, Disc Drive

and Flat Panel Display manufacturing industries since 1983

 

 

Home      About Us      Semiconductor Wet Process Equipment      Photovoltaic Wet Process Equipment

 

Biomedical Wet Process Equipment      Wafer Cassettes and Substrate Carriers      PC Board Wet Process Equipment

 

RFID Tag Wet Process Equipment      Surplus Semiconductor Wet Process Equip      Field Service and Spare Parts

 

Warranty and Terms and Conditions      News Releases      Contact Information

 

 

 

Model WPS-ECD-Au Series, Electro Chemical Deposition System

 

 

The Wafer Process Systems Inc. WPS-ECD-Au Series, Electro Chemical Deposition Wet Process System is designed to process Si, GaAs and Ceramic substrates for Au Electro Chemical Deposition process using both Cyanide and Sulfide based solutions.
The System is designed for use with Wafer Process Systems Inc. proprietary cathode and anode assemblies for processing single or multiple substrates with single or dual sided deposition. The Rectifiers are either remoted or incorporated into the system weldment. The Rectifiers remote Interface has a sealed keypad with 4 x 5 inch display for local programming and monitoring of power supply settings and displaying features and functions. The System is constructed out of Stress Relieved Polypropylene or FM Approved 4910 Compliant flame retardant CPVC, PVC-C, Kynar® (PVDF) or Halar® (ECTFE) for corrosion resistance to all process solutions. Safety and ergonomics are main aspects in the system design. All fluid components are accessible through removable front and rear access panels. All electrical components are accessible through front control panels and incorporate interlock switches with EPO interface for safety. Standard features include emergency power off circuit with remote mushroom switch and remote load center and contactor,  Photohelicâ low exhaust indicator with audible / visual alarm and EPO interface to eliminate the ability to operate equipment in the event of no exhaust, N2 purged head case with purge pressure interlock and EPO interface, plenum liquid level monitor with audible / visual alarm and EPO interface with auto DI water shutoff, back wall and plenum exhaust, recessed deck with 360° lip exhaust to insure capture of fumes during transfer  of wafers. All chemical wetted components are PVDF or PFA. All electrical components are UL, CSA or CE listed. All system electrical components are guaranteed for three years and All system DI Water components are guaranteed for three years and provide a 98% uptime.

 

 

Model WPS-ECD-Au Series, Electro Chemical Deposition System Cathode and Anode Assemblies

 

Wafer Process Systems Inc. PVDF cathode assemblies to accommodate multiple substrate of various sizes and shapes for processing

in a vertical orientation. Features include one piece PVDF open back side design cathode assembly with integral handle, PFA

Teflon coated stainless steel fixed position back side contact pins with four point contact to substrate. Stationary contact pins

provide substrate support and backside contact. Additional features include PFA Teflon coated stainless steel 90° rotary contact

pins with knurled knobs for rotating contact pins for removal of substrate. PVDF dove tail assembly to interface with plating vessel cathode support track. Male cathode electrical jack connector to interface with fixed position female jack connector wired to

plating rectifier power source.

 

 

 

Wafer Process Systems Inc. PVDF anode assemblies to accommodate multiple substrate various of sizes and shapes for

processing in a vertical orientation. Features include a three piece PVDF anode assembly with Platinum Clad Niobium expanded

mesh anode material, integral handle with flange mounting, two sided anode mesh exposure with a 1.5 to 1 surface ratio with

substrate and electrical jack contact connector to interface with plating rectifier power source. Anode assemblies are for use

with Wafer Process Systems PVDF multiple substrate cathode assemblies with either open or closed back side.

 

 

 

 

Plating Samples of Blind Side Vias

 

 

Au Plated Via Sample A

 

 

 

Au Plated Via Sample B

 

 

 

Au Plated Via Sample C

 

 

Standard Safety and Service Features:

 

            -           Three year warranty on all system electrical components and DI water components and two year warranty on all

                        chemical fluid components.

 

            -           Emergency power off circuit with remote mushroom kill switch located on front of cabinet and remote lock out

                        tag out knife switch electrical power disconnect.

 

            -           All UL, CSA or CE listed high voltage electrical components with GCFI power circuit interrupt for all heat load

                        power circuits and component level circuit fused circuit protection.

 

            -           Photohelic® low exhaust monitor with audible and visual alarm to interface with emergency power off circuit.

 

            -           N2 purged electrical control panel enclosure with flow meter and purge pressure interlock to interface with

                        emergency power off circuit.

 

            -           Plenum liquid level sensor located in chemical and rinse vessel plenum to interface with emergency power off

                        circuit with audible and visual alarm.

 

            -           UL Listed Photo Electronic Smoke Detector to interface with emergency power off circuit.

 

            -           FM Approved Noveon® PVC-C constructed weldment with integral secondary containment plenum.

 

            -           Casters and leg levelers for transportation and installation.

 

            -           Electrical interlock switch keyed bypass switch to eliminate deactivation during servicing of tool.

 

            -           Stainless steel N2 and CDA manifold with high pressure and low pressure regulators with gauges.

 

            -           Flow through PFA Teflon DI Water manifold with Flaretek Teflon tube fittings and auto DI water shutoff.

 

            -           Removable front or rear access plumbing panels and electrical access panels with interlock switches to interface with

                        emergency power off circuit.

 

 

Optional Features:

 

            -           Access coded process operation requires Operator ID (Numeric), Recipe Select (Numeric), Product Lot

                        Identification (Alfa-Numeric), Chemical Data (Manufacturer, Lot Identification, Mixture Ratio, and Date of Dispense).

 

            -           Data logging of all PLC based controls.

 

            -           Microprocessor based Graphical User Interface with real time data acquisition and control.

 

            -           Automatic Bulk Chemical Dispense.

 

            -           Vertical HEPA or ULPA laminar flow air filtration.

 

            -           FM Approved 304 stainless steel constructed weldment with #4 finished and integral secondary containment

                        plenum.

 

            -           FM Approved 316 stainless steel constructed weldment with mirror polished finished and integral secondary

                        containment plenum.

            -           FM Approved CO2 Flame Suppression System with Dual Mode UV/IR flame detectors.

 

Wafer Process Systems Inc. * 3641 Charter Park Drive * San Jose, California 95136 * Ph. (408) 445-3010 * Fax (408) 445-3004       *  Web Address www.waferprocess.com Email @ info@waferprocess.com   *