Wafer Process Systems Inc. Model WPS-FA-RA-2002-3001 is Fully-Automated Front and Rear Access Batch Wet Chemical Process System with 200MM and 300MM process capability which incorporates Y/Z Linear Servo Positioning Systems to provide a wide range of movement controls to accommodate various process needs. Systems are designed to accommodate two each 200MM ettes with twenty five wafers each cassette or one each 300MM wafer cassette with twenty six wafers to provide broader process capabilities.

Wafer Process Systems Inc. Liquid Diffusion Technology (LDT) provides enhanced drying performance for a variety of substrates and material surfaces. This proprietary drying process and its subsystems control the creation of an ultra-pure IPA Aerosol Layer that moves across a motionless substrate to diffusively remove water, without leaving watermarks.

Dont be fooled by the immitations. Other manufacturers can provide you an IPA Dryer using the Surface Tension Gradient process which uses heated N2 as the media to transfer the IPA to the drying chamber. Heating the IPA poses additional process and safety issues which our IPA Aerosol Dryer does not.

Wafer Process Systems LDT Dryer uses a patented Venturi process which creates an Aerosol of IPA with specific droplet sizes which is introduce directly into the dryer chamber without heating the N2. The use of an Aerosol eliminates the safety hazards associated with IPA Vapor Dryers. LDT Drying Technology is Cleaner and Safer than STG Drying Technology. Wafer Process Systems Inc. can do what the competitors have shown you they can't.

Principle of Operation

Wafer Process Systems Inc. manufactures world class Automated Bulk Chemical Delivery Systems using precision fluid controls and components for all wet process applications. Applications include bulk chemical delivery, point of use chemical recirculation and filtration, point of use chemical metering, and chemical waste recovery.

Wafer Process Systems Inc. Model WPS-SLFFH-FM-PVC-C, Factory Mutual Approved Noveon PVC-C Slopped Front Fume Hood Wet Process System is designed to process Si and GaAs wafers in a class 10 environments. Safety and ergonomics are main aspects in the system design.

Wafer Process Systems Inc. Model WPS-SQFFH-FA-FM-PVC-C, Factory Mutual Approved Noveon PVC-C Square Front Fume Hood Wet Process System is designed to process Si and GaAs or InP wafers in a class 10 environment or use in parts cleaning of metal deposition, oxide deposition tools components such as spheres, quartz tubes in a class 10 environment.

The Wafer Process Systems Inc. The WPS ECD-Au-4C Series, Electro Chemical Deposition Wet Process System is designed to process Si, GaAs and Ceramic substrates for Au Electro Chemical Deposition process using both Cyanide and Sulfide based solutions. The System is designed for use with Wafer Process Systems Inc. proprietary cathode and anode assemblies for processing single substrates with horizontal orientation (Fountain Plating), single sided deposition with vertical substrate orientation or dual sided deposition with vertical substrate orientation.

Wafer Process Systems Inc. WPS-ECD-Au Series, Electro Chemical Deposition Wet Process System is designed to process Si, GaAs and Ceramic substrates for Au Electro Chemical Deposition process using both Cyanide and Sulfide based solutions. The System is designed for use with Wafer Process Systems Inc. proprietary cathode and anode assemblies for processing single or multiple substrates with single or dual sided deposition.

Wafer Process Systems Inc. Model WPS-800-VLF-FM-SS, Factory Mutual Approved Stainless Steel Solvent Wet Process System are designed to process Si and GaAs wafers in a class 10 environment. Systems are constructed out of FM approved Stainless Steel for resistance to all solvent processes and fire. Safety and ergonomics are main aspects in the system design.

Wafer Process Systems Inc. Model WPS-VLF-800-FA-FM-PVC-C, Factory Mutual Approved Noveon PVC-C Vertical Laminar Flow Front Access Wet Process System is designed to process Si and GaAs wafers in a class 10 environments.

Wafer Process Systems Inc. automation concepts which incorporate Dual Axis Linear Motion or Rotary Motion Positioning Systems in either pneumatic or servo applications provide a wide range of cost effective methods for substrate handling.

Wafer Process Systems Inc. performs in field modifications to existing equipment installations to accommodate process changes and/or upgrades for our customers equipment without the need of expensive facility cost associated with removal and installation of new equipment.